J. F. Oviedo, L. Trojman, T. Kauerauf, and E. A. Bonifaz, “Thermal-Electrical finite element analysis of nanometric copper vias under high fluence stress”, ACI Av. Cienc. Ing. (Quito), vol. 5, no. 2, Dec. 2013, doi: 10.18272/aci.v5i2.139.