OVIEDO, Juan F.; TROJMAN, Lionel; KAUERAUF, Thomas; BONIFAZ, Edison A. Thermal-Electrical finite element analysis of nanometric copper vias under high fluence stress. ACI Avances en Ciencias e Ingenierías, [S. l.], v. 5, n. 2, 2013. DOI: 10.18272/aci.v5i2.139. Disponível em: https://revistas.usfq.edu.ec/index.php/avances/article/view/139. Acesso em: 30 apr. 2026.